Sales Manager & Technical Program Manager
Sales & Engineering Manager for Subcontract Assembly and Test. Based in Arizona, responsible for Texas, Arizona & So. California. Customer responsibilities included all Leadframe, HLA/TLA, MEMS, Air Cavity, SiP, WLCSP, Flipchip, MicroSD & BGA and MicroBGA packages. Generated new business opportunities and new customers as well as managed all customer qualifications, programs, pricing, contracts, NDA's, new designs and technology.
- 100% customer satisfaction on all sales and engineering support. Met or exceeded all customer sales objectives.
- Procured 5 new product quals in first half of 2012. 5 other new designs pending qual (WLCSP & MEMS FC for mobile/tablet applications). 15+ other product designs in process of review and/or approval for various applications.
- Generated 10+ new quotes from existing customers for added business revenue opportunities.
- Secured 3 new customers for assembly and test in the first half of 2012. Packaging/Site qualification in progress.
- Technical articles published in trade magazines. Speaker at several forums. Expert in new LF package technology.